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| MQFP Metric Quad Flat Pack * 10 x 10mm to 32 x 32mm body sizes * 44 to 240 lead counts * Lead pitch range from 0.80mm to 0.50mm FEATURES * Body Sizes: 10 x 10mm to 32 x 32mm * Package Height: 2.0 mm to 3.4mm * Lead Counts: 44L to 240L * Lead Pitch: 0.80mm to 0.50mm * Wide range of open tool leadframe and die pad sizes available * Moisture Sensitivity: JEDEC Level 3 * JEDEC standard compliant * Lead-free and Green material sets available * Copper and alloy leadframes available DESCRIPTION STATS ChipPAC's Metric Quad Flat Pack (MQFP) is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. The MQFP is targeted at cost sensitive applications while providing a high degree of thermal and electrical performance. Offered in a wide range of body sizes and pin counts, the MQFP provides designers with the flexibility and convenience of meeting their packaging needs for a large variety of device designs. APPLICATIONS * ASIC * DSP * Gate Array * Logic / Microprocessors / Controllers * Multimedia, PC Chipsets, Others www.statschippac.com MQFP Metric Quad Flat Pack SPECIFICATIONS Die Thickness Gold Wire Lead Finish Marking Packing Options 380-560m (15-22mils) range preferred 25/30m (1.0/1.2mils) diameter, 99.999%Au 85/15 Sn/PB or Matte Tin Laser / ink JEDEC tray / tape and reel RELIABILITY Moisture Sensitivity Level Temperature Cycling High Temperature Storage Pressure Cooker Test Liquid Thermal Shock (opt) JEDEC Level 3 -65C/150C, 1000 cycles 150C, 500 hrs 121C, 100% RH, 2 atm, 168 hrs -55C/125C, 1000 cycles THERMAL PERFORMANCE, ja (C/W) Package 100L 208L Body Size (mm) 14 x 14 x 2.0 28 x 28 x 3.4 Pad Size (mm) 9.0 x 9.0 14.0 x 14.0 Die Size (mm) 7.8 x 7.8 10.2 x 10.2 Thermal Performance, ja (C/W) 37.0 24.8 Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2. ELECTRICAL PERFORMANCE Electrical parasitic data is highly dependent on the package layout. 3D electrical simulation can be used on the specific package design to provide the best prediction of electrical behavior. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire. Conductor Component Wire Lead (10 x 10mm, 44L) Total (10 x 10mm, 44L) Wire Lead (32 x 32mm, 240L) Total (32 x 32mm, 240L) 2 11.0 - 12.6 Length (mm) 2 2.4 - 3.2 Resistance (mOhms) 120 19.0 - 25.0 139 - 145 120 88.0 - 100.8 208 - 220.8 Inductance (nH) 1.65 1.56 - 1.75 3.21 - 3.4 1.65 6.05 - 7.25 7.7 - 8.9 Inductance Mutual (nH) 0.45 - 0.85 0.70 - 0.79 1.15 - 1.64 0.45 - 0.85 3.33 - 3.99 3.78 - 4.84 Capacitance (pF) 0.10 0.31 - 0.38 0.41 - 0.48 0.10 1.64 - 1.89 1.74 - 1.99 Capacitance Mutual (pF) 0.01 - 0.02 0.14 - 0.17 0.15 - 0.19 0.01 - 0.02 0.66 - 0.76 0.67 - 0.78 CROSS-SECTION PACKAGE CONFIGURATIONS Package Size (mm) 10 x 10 14 x 14 14 x 20 28 x 28 32 x 32* Lead Count 44, 52 64, 80, 100 64, 80, 100, 128 120, 128, 144, 160, 208 240 Note: *Cavity down configuration available. Corporate Office Global Offices 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823 USA 510-979-8000 JAPAN 81-43-351-3320 KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 CHINA 86-21-5976-5858 UK 44-1483-413-700 MALAYSIA 603-4257-6222 NETHERLANDS 31-38-333-2023 The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. (c)Copyright 2005. STATS ChipPAC Ltd. All rights reserved. January 2005 |
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